Embedded electronic device package structure

ABSTRACT

An embedded electronic device package structure includes a core layer, an electronic device, a first dielectric layer, a second dielectric layer and conductive vias. The core layer has cavity, a first surface and a second surface opposite to the first surface. The electronic device is disposed in the cavity. The first dielectric layer disposed on the first surface is filled in part of the cavity and covers one side of the electronic device. The second dielectric layer disposed on the second surface is filled in the cavity, covers another side of the electronic device and connects the first dielectric layer. The first and the second dielectric layers fully cover the electronic device. The conductive vias are disposed around the surrounding of the electronic device and penetrates through the first and the second dielectric layer and the core layer. The conductive vias respectively connects the first and the second dielectric layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a package structure, in particular, toan embedded electronic device package structure.

2. Description of Related Art

The complication of semiconductor devices has been increased, and atleast part of the reasons is user's demands for increasing processingspeed and decreasing the sizes of the devices. Although the advantagesof increasing processing speed and decreasing sizes of the devices aresignificant, they also cause property problems of the semiconductordevice. In particular, higher clock speed may increase the frequency ofconverting signal level, such that the strength of electromagneticemission with higher frequency or shorter wavelength is increased.Electromagnetic emission may radiate from a source semiconductor deviceand emit into a neighboring semiconductor device. If the electromagneticemission emitting toward the neighboring semiconductor device is strongenough, the electromagnetic emission may affect operation of the(neighboring) semiconductor device. This phenomenon sometimes is calledelectromagnetic interference (EMI). Semiconductor devices with smallersizes suffer from EMI issue more seriously, because the semiconductordevices (with smaller sizes) are disposed in an electronic system withhigher density, such that the neighboring semiconductor devices receivestronger and unwanted electromagnetic emission.

One way to diminish the electromagnetic interference is to shield oneset of the semiconductor devices in the semiconductor device package. Inparticular, by disposing grounding conductive casing or conductivehousing at the outside of the package structure, shielding effect isachieved. When the electromagnetic emission radiates from the inside ofthe package structure toward the inner surface of the casing, at leastpart of the electromagnetic emission is shorted, so as to diminish thestrength of the electromagnetic emission which is capable of penetratingthe casing and affecting the operation of the neighboring semiconductordevices. Similarly, when the electromagnetic emission radiates from theneighboring semiconductor devices toward the outer surface of thecasing, the similar shorted situation happens, so as to diminish theelectromagnetic interference affecting the semiconductor devices in thepackage structure.

However, even though the conductive casing may diminish theelectromagnetic interference, there are a lot of disadvantages in usingthe conductive casing, for example, the casing generally is fixed at theoutside of the semiconductor device package by adhesive paste, andbecause the stickiness of the adhesive paste may decrease due totemperature, humidity and other environmental factors, the casing mayeasily peel off or fall off. Moreover, the size and the shape of thecasing need to correspond to the size and the shape of the packagestructure, thus, different sizes and shapes of semiconductor devicepackages need to go with different casings to contain different packagestructures. This would further increase production cost and time. Moreimportantly, the casing covering the outside of the semiconductor devicewould increase the volume of the package structure, so the packagevolume may not be effectively decreased, and this type of casing may notbe applied to embedded electronic device package structure with higherpackage density, which is against the market demands for light, thin,short, small, high density, and function-integrated electronic products.

SUMMARY OF THE INVENTION

The present invention is directed to an embedded electronic devicepackage structure, which the volume thereof is small and has thefunction electromagnetic shielding.

The present invention provides an embedded electronic device packagestructure including a core layer, an electronic device, a firstdielectric layer, a second dielectric layer and a plurality ofconductive vias. The core layer has a cavity, a first surface and asecond surface opposite to the first surface. The electronic device isdisposed in the cavity. The first dielectric layer disposed on the firstsurface is filled in the cavity, and covers one side of the electronicdevice. The first dielectric layer is filled in part of the cavity. Thesecond dielectric layer disposed on the second surface is filled in thecavity, and covers another side of the electronic device. The seconddielectric layer is connected with the first dielectric layer. The firstdielectric layer and the second dielectric layer fully cover theelectronic device. The conductive vias are disposed around thesurrounding of the electronic device and penetrates through the firstdielectric layer, the second dielectric layer and the core layer. Theconductive vias respectively connect the first dielectric layer and thesecond dielectric layer.

According to an embodiment of the present invention, the conductive viasinclude plated through holes (PTH).

According to an embodiment of the present invention, each of theconductive vias includes a first conductive via and a plurality ofsecond conductive vias. The first conductive via penetrates through thecore layer. The second conductive vias respectively connect from twoopposing ends of the first conductive via to the first dielectric layerand the second dielectric layer.

According to an embodiment of the present invention, the embeddedelectronic device package structure further includes a plurality ofconductive layers respectively filled in the conductive vias.

According to an embodiment of the present invention, the embeddedelectronic device package structure further includes a plurality ofconductive layers respectively covering the inner surface of theconductive vias.

According to an embodiment of the present invention, the firstconductive via includes plated through hole.

According to an embodiment of the present invention, the firstconductive via includes laser through hole.

According to an embodiment of the present invention, the embeddedelectronic device package structure further includes a plurality ofconductive poles. The electronic device further includes a plurality ofpads facing the first dielectric layer. The conductive polesrespectively connect from the pads to the first dielectric layer.

According to an embodiment of the present invention, the conductivepoles include laser vias.

According to an embodiment of the present invention, the embeddedelectronic device package structure further includes an adhesive layerfilled between the pads.

Based on the description above, in the embedded electronic devicepackage structure of the present invention, the conductive viaspenetrate through the first dielectric layer and the second dielectriclayer and are disposed around the electronic device embedded in thefirst dielectric layer and the second dielectric layer. The innersurface of each conductive via is covered with metal conductive layer,such that the conductive vias not only are the paths of electricalconnection, but also provides the electronic device with the function ofelectromagnetic shielding. Accordingly, the embedded electronic devicepackage structure of the present invention takes advantage of theexisting space and structure in the package structure, such that noextra shielding cover is needed to be disposed in the embeddedelectronic device package structure to provide the electronic devicewith the function of electromagnetic shielding. Therefore, the presentinvention not only decreases the package volume, simplifies themanufacturing process, but also saves the production cost of theshielding casing.

In order to make the aforementioned and other features and advantages ofthe invention more comprehensible, embodiments accompanying figures aredescribed in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view of an embedded electronicdevice package structure according to an embodiment of the presentinvention.

FIG. 2 is a schematic top view of the embedded electronic device packagestructure in FIG. 1.

FIG. 3 is a schematic cross-sectional view of an embedded electronicdevice package structure according to another embodiment of the presentinvention.

FIG. 4 is a schematic cross-sectional view of an embedded electronicdevice package structure according to another embodiment of the presentinvention.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a schematic cross-sectional view of an embedded electronicdevice package structure according to an embodiment of the presentinvention. FIG. 2 is a schematic top view of the embedded electronicdevice package structure in FIG. 1. Referring to both FIG. 1 and FIG. 2,the embedded electronic device package structure 100 includes a corelayer 130, an electronic device 120, a first dielectric layer 112, asecond dielectric layer 114 and a plurality of conductive vias 140. Thecore layer 130 has a cavity 136, a first surface 132 and a secondsurface 134 opposite to the first surface 132. The electronic device 120is disposed in the cavity 136 of the core layer 130. The firstdielectric layer 112 and the second dielectric layer 114 arerespectively pressed onto the top surfaces and the bottom surfaces ofthe electronic device 120 and the core layer 130 from the top and thebottom, such that the electronic device 120 and the core layer 130 arecovered by the first dielectric layer 112 and the second dielectriclayer 114. In the present embodiment, the electronic device 120 is, forexample, a chip. The embedded electronic device package structure 100further includes a plurality of conductive poles 160. The electronicdevice 120 further includes a plurality of pads 122, wherein the pads122 facing the first dielectric layer 112. The conductive poles 160respectively connect from the pads 122 to the first dielectric layer112. The conductive poles 160 are formed as laser vias by, for example,laser drilling, and then conductive material is filled in the laser viasby, for example, electroplating, so as to enable the pads 122 of theelectronic device 120 to be electrically connected to the outer surfaceof the first dielectric layer 112. Furthermore, in the presentembodiment, the embedded electronic device package structure 100 furtherincludes an adhesive layer 170 filled between the pads 122.

Accordingly, the conductive vias 140 are, as shown in FIG. 2,respectively disposed around the surrounding of the electronic device120, and penetrate through the first dielectric layer 112, the seconddielectric layer 114 and the core layer 130 surrounding the electronicdevice 120. Each of the conductive vias 140 connects the firstdielectric layer 112 and the second dielectric layer 114. In the presentembodiment, the embedded electronic device package structure 100 furtherincludes a plurality of conductive layers 150 respectively covering theinner surfaces of the conductive vias 140, so as to electrically connectthe first dielectric layer 112 and the second dielectric layer 114. Theconductive vias 140 are, for example, plated through holes, which meanthe conductive vias 140 are through holes, and the conductive layers 150are respectively formed on the inner walls of the conductive vias 140 byelectroplating.

As the disposition described above, the embedded electronic devicepackage structure 100 of the present invention is capable of having theconductive vias 140, as shown in FIG. 2, penetrating through thedielectric layers 112, 114, also, the conductive vias 140 are disposedaround the surrounding of the electronic device 120 embedded in thedielectric layers 112, 114, and the inner walls of the conductive vias140 are covered by metal layers, such that the conductive vias 140 notonly are the paths of electrically connection, but also provide theelectronic device 120 with electromagnetic shielding. Therefore, theembedded electronic device package structure 100 of the presentinvention takes advantage of the existing space and structure in thepackage structure, such no extra shielding cover is needed to bedisposed in the embedded electronic device package structure 100 toprovide the electronic device 120 with the function of electromagneticshielding.

FIG. 3 is a schematic cross-sectional view of an embedded electronicdevice package structure according to another embodiment of the presentinvention. It is noted that the embodiment illustrated in FIG. 3 usesthe same reference numerals and partial content of the previousembodiment. The same reference numerals represent similar components,and repeated description is omitted. Those not described in thefollowing embodiment can be referred to in the above embodiment.Referring to FIG. 3, each of the conductive vias 140 a of the embeddedelectronic device package structure 100 a in the present embodimentincludes a first conductive via 140 and a plurality of second conductivevias 144. The first conductive via 142 penetrates through the core layer130. The second conductive vias 144 respectively penetrate through thefirst dielectric layer 112 and the second dielectric layer 114, so as torespectively connect from two opposing ends of the first conductive via142 to the outer surfaces of the first dielectric layer 112 and thesecond dielectric layer 114 to electrically connect the first dielectriclayer 112 and the second dielectric layer 114. In the presentembodiment, the first conductive via 142 is, for example, plated throughhole penetrating the core layer 130, which means the first conductivevia 142 is a through hole, and metal conductive layer is respectivelyformed on the inner wall of the first conductive via 142 byelectroplating. The second conductive vias 144 are formed as laser viasconnecting the first conductive via 142 by, for example, laser drilling,and then metal conductive material is filled in the laser vias by, forexample, electroplating, so as to respectively connect from the twoopposing ends of the first conductive via 142 to the first surface 112and the second surface 114. Moreover, in the present embodiment,patterned conductive layers 146 may further be disposed on the twoopposing ends of the first conductive via 142 to extending theelectrically conductive range, such that the second conductive vias 144only have to connect to the patterned conductive layers 146 to beelectrically connected to the first conductive via 142 through thepatterned conductive layers 146, so as to increase the dispositionflexibility of the second conductive vias 144 and the tolerance foralignment errors occurring in manufacture processes.

As the disposition described above, the present embodiment adopts theconductive vias including the first conductive via 142 penetrating thecore layer 130 and the second conductive vias 144 respectivelyconnecting from two opposing ends of the first conductive via 142 to theouter surfaces of the first dielectric layer 112 and the seconddielectric layer 114, and makes the conductive vias 142, 144 disposedaround the surrounding of the electronic device 120 to electricallyconnect the first dielectric layer 112 and the second dielectric layer114. The present embodiment further uses the metal conductive materialin the conductive vias 142, 144 to provide the electronic device 120with the function of electromagnetic shielding. Therefore, the presentembodiment adopts the conductive vias 142, 144 designed to be the pathsof electrical connection in the embedded electronic device packagestructure 100 a to provide the electronic device 120 withelectromagnetic shielding. Accordingly, the embedded electronic devicepackage structure 100 a takes advantage of the existing space andstructure in the package structure, such that no extra shielding coveris needed to be disposed in the embedded electronic device packagestructure 100 a to provide the electronic device 120 with the functionof electromagnetic shielding.

FIG. 4 is a schematic cross-sectional view of an embedded electronicdevice package structure according to another embodiment of the presentinvention. It is noted that the embodiment illustrated in FIG. 4 usesthe same reference numerals and partial content of the previousembodiment illustrated in FIG. 3. The same reference numerals representsimilar components, and repeated description is omitted. Those notdescribed in the following embodiment can be referred to in the aboveembodiment. Referring to FIG. 4, each of the conductive vias 140 b ofthe embedded electronic device package structure 100 b in the presentembodiment includes a first conductive via 148 and a plurality of secondconductive vias 144. The first conductive via 148 penetrates through thecore layer 130. However, in the present embodiment, the first conductivevia 148 are formed as two laser vias respectively on a top side and abottom side of the core layer by, for example, laser drilling. The twolaser vias are connected to each other and together penetrate the corelayer 130, and then metal conductive material is filled in the firstconductive via 148 described above by, for example, electroplating. Thesecond conductive vias 144 are formed as laser vias connecting the firstconductive via 148 by, for example, laser drilling, and then metalconductive material is filled in the laser vias by, for example,electroplating, so as to respectively connect from the two opposing endsof the first conductive via 148 to the outer surfaces of the firstdielectric layer 112 and the second dielectric layer 114, thus, thefirst dielectric layer 112 is electrically connected to the seconddielectric layer 114. It is noted that the above-mentioned embodimentsare merely exemplary, and the present invention is not limited thereto.It will be apparent to one of the ordinary skill in the art thatmodifications to the described embodiment may be made without departingfrom the spirit of the invention. Any embedded electronic device packagestructure that uses the conductive vias therein, which penetrates thepackage structure and are disposed around the electronic device, toprovide the electronic device with electromagnetic shielding would fallwithin the scope of the invention.

Based on the description above, in the embedded electronic devicepackage structure of the present invention, the conductive viaspenetrate through the first dielectric layer and the second dielectriclayer and are disposed around the electronic device embedded in thefirst dielectric layer and the second dielectric layer. The innersurface of each conductive via is covered with metal conductive layer,such that the conductive vias not only are the path of electricalconnection, but also provides the electronic device with the function ofelectromagnetic shielding. Accordingly, the embedded electronic devicepackage structure of the present invention takes advantage of theexisting space and structure in the package structure, such that noextra shielding cover is needed to be disposed in the embeddedelectronic device package structure to provide the electronic devicewith the function of electromagnetic shielding. Therefore, the presentinvention not only decreases the package volume, simplifies themanufacturing process, but also saves the production cost of theshielding casing.

Although the invention has been described with reference to the aboveembodiments, it will be apparent to one of the ordinary skill in the artthat modifications to the described embodiment may be made withoutdeparting from the spirit of the invention. Accordingly, the scope ofthe invention will be defined by the attached claims not by the abovedetailed descriptions.

What is claimed is:
 1. An embedded electronic device package structure,comprising: a core layer, having a cavity, a first surface and a secondsurface opposite to the first surface; an electronic device, disposed inthe cavity of the core layer; a first dielectric layer, disposed on thefirst surface of the core layer, and filled in the cavity of the corelayer, the first dielectric layer covering one side of the electronicdevice, wherein the first dielectric layer is filled in part of thecavity; a second dielectric layer, disposed on the second surface of thecore layer, and filled in the cavity of the core layer, the seconddielectric layer covering another side of the electronic device, whereinthe first dielectric layer and the second dielectric layer fully coverthe electronic device; and a plurality of conductive vias, disposedaround the surrounding of the electronic device and penetrating throughthe first dielectric layer, the second dielectric layer and the corelayer, the conductive vias respectively connecting the first dielectriclayer and the second dielectric layer.
 2. The embedded electronic devicepackage structure as claimed in claim 1, wherein the conductive viascomprise plated through holes (PTH).
 3. The embedded electronic devicepackage structure as claimed in claim 1, wherein each of the conductivevias comprises a first conductive via and a plurality of secondconductive vias, the first conductive via penetrates through the corelayer, the second conductive vias connect respectively from two opposingends of the first conductive via to the first dielectric layer and thesecond dielectric layer.
 4. The embedded electronic device packagestructure as claimed in claim 3, wherein the first conductive viacomprises plated through hole (PTH).
 5. The embedded electronic devicepackage structure as claimed in claim 3, wherein the first conductivevia comprises laser through hole.
 6. The embedded electronic devicepackage structure as claimed in claim 1, further comprising a pluralityof conductive layers, respectively filled in the conductive vias.
 7. Theembedded electronic device package structure as claimed in claim 1,further comprising a plurality of conductive layers, respectively coverthe inner surfaces of the conductive vias.
 8. The embedded electronicdevice package structure as claimed in claim 1, further comprising aplurality of conductive poles, the electronic device further comprisinga plurality of pads facing the first dielectric layer, and theconductive poles respectively connecting from the pads to the firstdielectric layer.
 9. The embedded electronic device package structure asclaimed in claim 8, wherein the conductive poles comprise laser vias.10. The embedded electronic device package structure as claimed in claim8, further comprising an adhesive layer, filled between the pads.